The Ferdinand-Braun-Institut (FBH) extends its cleanroom equipment in order to realize pilot-lines for bipolar InP-Chiplets and GaAs Laser Chiplets. The FBH wants to acquire a dual ion beam system for its GaAs Laser Chiplets pilot line in order to increase its coating capabilities as well as increase throughput. The Ion beam system should be able to coat laser bars, laser coupons and PICs that are mounted in jigs and wafers up to a diameter of 200 mm with high quality optical coatings such as Al2O3, TiO2, SiO2 and Ta2O5. Key system specifications • Dual chamber (loadlock and process chamber) system capable of ion beam deposition, ion beam etching and dual ion beam sputtering • High level of uniformity over an 8” Wafer • Target-carousel with 4 targets for changing targets without venting the system • Automatic wafer handling • Capability to transfer and process jigs with laser bars having a resonator length larger than 10 mm. • Possibility to control processes using an optical thickness monitor • Small footprint due to the limited space that is available in the cleanroom Interface to MES Details to be clarified in the negotiation process; the tool delivers logfiles, which is the basic requirement for integration into the FBH-MES. A full integration using a SECS/Gem interface is desirable.

Ion beam deposition system

The Ferdinand-Braun-Institut (FBH) extends its cleanroom equipment in order to realize pilot-lines for bipolar InP-Chiplets and GaAs Laser Chiplets. The FBH wants to acquire a dual ion beam system for its GaAs Laser Chiplets pilot line in order to increase its coating capabilities as well as increase throughput. The Ion beam system should be able to coat laser bars, laser coupons and PICs that are mounted in jigs and wafers up to a diameter of 200 mm with high quality optical coatings such as Al2O3, TiO2, SiO2 and Ta2O5. Key system specifications • Dual chamber (loadlock and process chamber) system capable of ion beam deposition, ion beam etching and dual ion beam sputtering • High level of uniformity over an 8” Wafer • Target-carousel with 4 targets for changing targets without venting the system • Automatic wafer handling • Capability to transfer and process jigs with laser bars having a resonator length larger than 10 mm. • Possibility to control processes using an optical thickness monitor • Small footprint due to the limited space that is available in the cleanroom Interface to MES Details to be clarified in the negotiation process; the tool delivers logfiles, which is the basic requirement for integration into the FBH-MES. A full integration using a SECS/Gem interface is desirable.