Automated 300 mm Die-to-Wafer thermocompression bonding tool - PR1275392-3460-W
Deadline:2 Dec 2026, 10:00
Tender information
Dresden, Kreisfreie Stadt
Type
Contract
Procedure
Negotiated with a call for competition
Ref. number
PR1275392-3460-W
Duration
9 months
PR1275392-3460-W Automated 300 mm Die-to-Wafer thermocompression bonding tool
Automated 300 mm Die-to-Wafer thermocompression bonding tool - PR1275392-3460-W
Automated 300 mm Die-to-Wafer thermocompression bonding tool
Buyer
Fraunhofer-Gesellschaft, Einkauf B12
Buyer
Fraunhofer-Gesellschaft, Einkauf B12
No time limit
29 days left
Important dates
2 Nov - Publication date
2 Dec - Deadline
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