Provision of Contract Agreement for the Provision of Chemical Mechanical Polishing Tool for a Minimum Period of 12 Months with the Option to Extend for Two Further Periods of up to 12 Months The University has a requirement for an electroplating system which shall be a fully enclosed, floor-standing tool designed for electrolytic copper deposition on 200 mm wafers for R&D and pilot-scale manufacturing. Please refer to the 'PURCH2860 – Schedule 1A – ITT’ for further details and specification This procurement process is being conducted using the Competitive Procedure with Negotiation (CPN) in accordance with the requirements of Regulation 30 of the PC(S)R 2015. Although this procurement is being conducted under the Competitive Procedure with Negotiation (CPN), it is structured differently from a typical CPN process. This approach has been adopted to enhance the efficiency of evaluating supplier responses across both stages (SPD and ITT).