Semi-Automatic Wafer Prober System for Characterization of 200-mm Wafers

Deadline:29 Oct 2026, 11:00

Tender information
Frankfurt (Oder), Kreisfreie Stadt
Type
Contract
Procedure
Open procedure
Ref. number
IHP-2026-046
The subject of the procurement is the supply, installation and commissioning of a semi-automatic wafer prober system for the electrical and high-frequency characterization of 200-mm wafers for research and laboratory use at IHP. The system shall include, among other components, a 200-mm wafer prober with vacuum chuck and precision positioning, individual probes, multi-contact probes for RF measurements up to at least 6 GHz, a probe card system, automated microscopy and camera equipment, as well as control and software components. The scope of supply also includes transport, installation, commissioning, training, documentation, warranty and spare-parts supply.

Semi-Automatic Wafer Prober System for Characterization of 200-mm Wafers

Description of the Procurement - Type and Scope of Supplies / Requirements The procurement comprises the supply of a complete semi-automatic wafer prober system for the electrical and RF characterization of 200-mm wafers for research and laboratory applications at IHP. The scope of supply includes, in particular, a semi-automatic 200-mm wafer prober with vacuum chuck, precision XY/Z/Theta positioning, shielded prober chamber, six individual electrical probes, two multi-contact probe holders suitable for RF measurements up to at least 6 GHz, and a probe card adapter. The system shall also include an automated microscope, color and side-view cameras, control PC, hardware control panel, control software, required cables, interfaces, power supplies and replacement probes. The system shall support DC, pulsed I-V and low-frequency impedance measurements up to at least 10 MHz as well as RF characterization. All components shall be technically compatible and capable of being operated as an integrated system. The procurement further includes complete delivery, transport, installation, configuration, commissioning, functional testing, on-site training and provision of all required technical, operating and safety documentation. The supplier shall also provide warranty, service and spare-parts/consumables availability for the specified warranty period. The system must comply with the specified mechanical, electrical, safety, EMC, CE, IT and environmental requirements and be suitable for integration into the existing IHP laboratory and IT infrastructure.

Buyer
IHP GmbH - Lebniz-Institut für innovative Mikroelektronik
buyer-email@mail.com
organization number
Open for offers
29 days left
Important dates
29 Sept - Publication date
29 Oct - Deadline
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