The object of this tender is the supply and commissioning of 2 300 mm full wafer automated TEM sample preparation tool. Both tools should be able to load 300mm wafers and allow for high-accurate automate TEM sample preparation. Both tools should be able to do full automated sample preparation of quality and ultra-thin samples (sub 20nm). Automated end-pointing of the TEM sample needs to be precise within nanometer range on a specific structure. In-system gas injection for carbon, TEOS and tungsten deposition is required.

JPA2026ID27A-28 - 1

Automated TEM Analysis Platform