Plasmasystem (IZM-115.1) - PR1115793-2590-P

1 piece: Plasmasystem (IZM-115.1) The formation of very fine RDLs (redistribution layers) < 5 µm on large organic substrates requires the replacement of wet-chemical processes by dry-etching. Due to the strongly anistropic character of plasma etching an undercut of the fine Cu line can be avoided, opening the way to structures of 2 µm and below. The plasma tool for panel up to 600mm will be a ICP system with yery high etch rates for organic materials like photoresists and ABF. In contrast to the existing plasma system, optimized for precise metal etching, the new ICP tool will allow development and use of very fast etching cycles, compatible with industrial processes.