Wafer cleaner / mask cleaner (IAF-08.3) - PR1146362-2050-P

Wafer cleaner / mask cleaner (IAF-08.3) The requirement is for a wafer and mask cleaning machine to be installed in an ISO Class 4 cleanroom and which must comply with European safety regulations for industrial equipment. The system is intended to remove particles and contaminants from wafers and lithography masks using aqueous and acidic solutions, based on the RCA cleaning process. To ensure safe operation and a long service life, the process chamber must be made of process-media-resistant material and be equipped with an extraction system and leak detection. The system must be capable of reliably removing particles larger than 250 nm from (quartz) glass or wafers in order to ensure the purity required for the processes in the Fraunhofer IAF cleanroom and not to compromise process yield. Translated with DeepL.com (free version)