VTT is looking to acquire an automated defect inspection tool for 200 mm and 300 mm patterned wafers. The tool will enable rapid tracking of defects that appear during the manufacturing process of functional devices (in-line and end-of-line in the Front-end process). The tool must be capable of detecting particles, voids, cracks, scratches, pits, bumps, and hazes in the pattern. The materials of the patterns that the machine must be able to analyze are silicon oxides and nitrides, polysilicon, metals, and photoresist. The object of the tender process and the technical requirements are described in more detail in the invitation to tender documents.