Picosecond ultrasonics film thickness measurement tool

Deadline:N/A

We were not able to find a link to the source, please find contact details in the documents.

Tender information

Helsinki-Uusimaa

Type

Contract award

Procedure

Negotiated without a call for competition

Ref. number

622453

Cassette-to-cassette measurement system using picosecond ultrasonics for materials characterization in semiconductor processes, enabling metal thickness metrology, implant monitoring, and thermal conductivity characterization.

Buyer

TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

Contract award

Onto Innovation

Awarded

Documents

Document name	Upload date	File size
First document.pdf	1 Jan 1970, 00:00	1 Bytes
Second document.pdf	1 Jan 1970, 00:00	1 Bytes

Contract award

Onto Innovation

Awarded

Information on this page originates from the following sources: TED, MeForm, Hilma

Buyer

TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

Contract awarded

Important dates

4 Aug - Publication date

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We were not able to find a link to the source, please find contact details in the documents.

Picosecond ultrasonics film thickness measurement tool

Documents

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