This tender concerns DTU Nano´s planned procurement of a Photonic Assembly Station and a Photonic Wafer Probe Station. The tender is split into to two lots – one for each of the two stations. Tenderers may choose to bid on one or both lots, which will be evaluated and awarded individually. The assembly station is for connecting fibre array units (FAUs) to an optical chip. The type of connection will be edge coupling using waveguides loops for alignment but if necessary, the alignment can also be performed either using the light source on the chip (if it exists) or by using an external light source and connecting two FAUs, one on each side of the chip. Thus, the main purpose of the machine is to do assembly and fiber attachment of photonic chips. The system shall support research, prototyping, process development, pilot manufacturing, and low-volume production activities within DTU Nano´s advanced fabrication facility.  DTU has activities within Silicon Photonics (SiPh), Photonic Integrated Circuits (PICs), Optical transceivers, Laser modules, Photodetectors, Fiber-optic assemblies, Co-packaged optics and Quantum photonic devices which we want to support in the best possible way. DTU therefore intends to purchase a reconfigurable, flexible, versatile machine. The purpose of the photonic wafer probe station is to characterise the quality of photonic integrated circuits (PICs). It should be possible to characterise both optical and electrical performance. For the optical characterisation, the main coupling in/out technique will be through grating couplers, but the equipment should be possible to be configured also for edge coupling to component facets in a grove on the wafer. In this case, different holders and fibres may be needed. The electrical characteristics are to be characterised both in DC as well as RF up to 40GHz using probe and/or probe cards. The system shall support research, development, process qualification, and routine characterization activities within DTU Nano´s advanced fabrication facility. – Lot nr.: 1 One Photonic Wafer Probe Station (Lot 1) The tender concerns a photonic wafer probe station to characterise the quality of photonic integrated circuits (PICs). It should be possible to characterise both optical and electrical performance. For the optical characterisation, the main coupling in/out technique will be through grating couplers but the equipment should be possible to be configured also for edge coupling. In this case, different holders and fibers may be needed. The electrical characterstics are to be characterised both in DC as well as RF up to 40GHz using probe and/or probe cards. Last tender date: 11/02/2026 22:59:00 Type of contract: Supplies Authority: Danmarks Tekniske Universitet - DTU Information URL: https://www.dtu.dk Document URL: https://eu.eu-supply.com/app/rfq/rwlentrance_s.asp?PID=461519&TID=200421875&B= Tenders URL: https://eu.eu-supply.com/app/rfq/rwlentrance_s.asp?PID=461519&TID=200421875&B= Duration contract start date : 12/05/2026 00:00:00 Criteria definitions: Price: 30 (The price to be evaluated is “Technical evaluation price”, specified in Appendix 2 – Prices. DTU uses a linear point scale model to evaluate the Tenderers’ prices. The linear model implies that the offered prices are converted into points. The offered prices are awarded points on a scale from 0-10. Thus, lowest price is awarded maximum points 10, while prices that are 100% or more expensive / higher than the lowest price are awarded 0 points. Other prices in between are awarded points according to the formula for linear interpolation.) Quality: 15 (The qualitative criteria will be assessed based on the Evaluation Requirements (3, 10, 11, 14, 15, 16 & 18) described in the specifications in Appendix 1 – Requirement Specification. Based on the assessment of fulfilments, points are awarded on a scale of 0-10.) Quality: 40 (The qualitative criteria will be assessed based on the Evaluation Requirements (20, 22, 25, 28, 29, 30, 33, 35, 37, 38, 41, 43, 47, 48, 49, 50, 51, 52, 54, 55, 59, 60 & 61) described in the specifications in Appendix 1 – Requirement Specification. Based on the assessment of fulfilments, points are awarded on a scale of 0-10.) Quality: 15 (The qualitative criteria will be assessed based on the Evaluation Requirements (65, 67 & 68) described in the specifications in Appendix 1 – Requirement Specification. Based on the assessment of fulfilments, points are awarded on a scale of 0-10.) – Lot nr.: 2 One Photonic Assembly Station (Lot 2) The tender is for buying an optical assembly station for connecting fiber array units (FAUs) to an optical chip. The type of connection will be edge coupling using waveguides loops for alignment but if, necessary, the alignment can also be performed either using the light source on the chip (if it exists) or by using an external light source and connecting two FAUs, one on each side of the chip. Last tender date: 11/02/2026 22:59:00 Type of contract: Supplies Authority: Danmarks Tekniske Universitet - DTU Information URL: https://www.dtu.dk Document URL: https://eu.eu-supply.com/app/rfq/rwlentrance_s.asp?PID=461519&TID=200421875&B= Tenders URL: https://eu.eu-supply.com/app/rfq/rwlentrance_s.asp?PID=461519&TID=200421875&B= Duration contract start date : 12/07/2026 00:00:00 Criteria definitions: Price: 30 (The price to be evaluated is “Technical evaluation price”, specified in Appendix 2 – Prices. DTU uses a linear point scale model to evaluate the Tenderers’ prices. The linear model implies that the offered prices are converted into points. The offered prices are awarded points on a scale from 0-10. Thus, lowest price is awarded maximum points 10, while prices that are 100% or more expensive / higher than the lowest price are awarded 0 points. Other prices in between are awarded points according to the formula for linear interpolation.) Quality: 15 (The qualitative criteria will be assessed based on the Evaluation Requirements (3, 8, 10, 11, 14, 15, 16 & 17) described in the specifications in Appendix 1 – Requirement Specification. Based on the assessment of fulfilments, points are awarded on a scale of 0-10.) Quality: 40 (The qualitative criteria will be assessed based on the Evaluation Requirements (21, 22, 24, 26, 27, 29, 30, 32, 34, 37, 40, 42, 44, 45 & 46) described in the specifications in Appendix 1 – Requirement Specification. Based on the assessment of fulfilments, points are awarded on a scale of 0-10.) Quality: 15 (The qualitative criteria will be assessed based on the Evaluation Requirements (51, 53 & 55) described in the specifications in Appendix 1 – Requirement Specification. Based on the assessment of fulfilments, points are awarded on a scale of 0-10.)

One Photonic Wafer Probe Station and one Photonic Assembly Station

This tender concerns DTU Nano´s planned procurement of a Photonic Assembly Station and a Photonic Wafer Probe Station. The tender is split into to two lots – one for each of the two stations. Tenderers may choose to bid on one or both lots, which will be evaluated and awarded individually. The assembly station is for connecting fibre array units (FAUs) to an optical chip. The type of connection will be edge coupling using waveguides loops for alignment but if necessary, the alignment can also be performed either using the light source on the chip (if it exists) or by using an external light source and connecting two FAUs, one on each side of the chip. Thus, the main purpose of the machine is to do assembly and fiber attachment of photonic chips. The system shall support research, prototyping, process development, pilot manufacturing, and low-volume production activities within DTU Nano´s advanced fabrication facility.  DTU has activities within Silicon Photonics (SiPh), Photonic Integrated Circuits (PICs), Optical transceivers, Laser modules, Photodetectors, Fiber-optic assemblies, Co-packaged optics and Quantum photonic devices which we want to support in the best possible way. DTU therefore intends to purchase a reconfigurable, flexible, versatile machine. The purpose of the photonic wafer probe station is to characterise the quality of photonic integrated circuits (PICs). It should be possible to characterise both optical and electrical performance. For the optical characterisation, the main coupling in/out technique will be through grating couplers, but the equipment should be possible to be configured also for edge coupling to component facets in a grove on the wafer. In this case, different holders and fibres may be needed. The electrical characteristics are to be characterised both in DC as well as RF up to 40GHz using probe and/or probe cards. The system shall support research, development, process qualification, and routine characterization activities within DTU Nano´s advanced fabrication facility. – Lot nr.: 1 One Photonic Wafer Probe Station (Lot 1) The tender concerns a photonic wafer probe station to characterise the quality of photonic integrated circuits (PICs). It should be possible to characterise both optical and electrical performance. For the optical characterisation, the main coupling in/out technique will be through grating couplers but the equipment should be possible to be configured also for edge coupling. In this case, different holders and fibers may be needed. The electrical characterstics are to be characterised both in DC as well as RF up to 40GHz using probe and/or probe cards. Last tender date: 11/02/2026 22:59:00 Type of contract: Supplies Authority: Danmarks Tekniske Universitet - DTU Information URL: https://www.dtu.dk Document URL: https://eu.eu-supply.com/app/rfq/rwlentrance_s.asp?PID=461519&TID=200421875&B= Tenders URL: https://eu.eu-supply.com/app/rfq/rwlentrance_s.asp?PID=461519&TID=200421875&B= Duration contract start date : 12/05/2026 00:00:00 Criteria definitions: Price: 30 (The price to be evaluated is “Technical evaluation price”, specified in Appendix 2 – Prices. DTU uses a linear point scale model to evaluate the Tenderers’ prices. The linear model implies that the offered prices are converted into points. The offered prices are awarded points on a scale from 0-10. Thus, lowest price is awarded maximum points 10, while prices that are 100% or more expensive / higher than the lowest price are awarded 0 points. Other prices in between are awarded points according to the formula for linear interpolation.) Quality: 15 (The qualitative criteria will be assessed based on the Evaluation Requirements (3, 10, 11, 14, 15, 16 & 18) described in the specifications in Appendix 1 – Requirement Specification. Based on the assessment of fulfilments, points are awarded on a scale of 0-10.) Quality: 40 (The qualitative criteria will be assessed based on the Evaluation Requirements (20, 22, 25, 28, 29, 30, 33, 35, 37, 38, 41, 43, 47, 48, 49, 50, 51, 52, 54, 55, 59, 60 & 61) described in the specifications in Appendix 1 – Requirement Specification. Based on the assessment of fulfilments, points are awarded on a scale of 0-10.) Quality: 15 (The qualitative criteria will be assessed based on the Evaluation Requirements (65, 67 & 68) described in the specifications in Appendix 1 – Requirement Specification. Based on the assessment of fulfilments, points are awarded on a scale of 0-10.) – Lot nr.: 2 One Photonic Assembly Station (Lot 2) The tender is for buying an optical assembly station for connecting fiber array units (FAUs) to an optical chip. The type of connection will be edge coupling using waveguides loops for alignment but if, necessary, the alignment can also be performed either using the light source on the chip (if it exists) or by using an external light source and connecting two FAUs, one on each side of the chip. Last tender date: 11/02/2026 22:59:00 Type of contract: Supplies Authority: Danmarks Tekniske Universitet - DTU Information URL: https://www.dtu.dk Document URL: https://eu.eu-supply.com/app/rfq/rwlentrance_s.asp?PID=461519&TID=200421875&B= Tenders URL: https://eu.eu-supply.com/app/rfq/rwlentrance_s.asp?PID=461519&TID=200421875&B= Duration contract start date : 12/07/2026 00:00:00 Criteria definitions: Price: 30 (The price to be evaluated is “Technical evaluation price”, specified in Appendix 2 – Prices. DTU uses a linear point scale model to evaluate the Tenderers’ prices. The linear model implies that the offered prices are converted into points. The offered prices are awarded points on a scale from 0-10. Thus, lowest price is awarded maximum points 10, while prices that are 100% or more expensive / higher than the lowest price are awarded 0 points. Other prices in between are awarded points according to the formula for linear interpolation.) Quality: 15 (The qualitative criteria will be assessed based on the Evaluation Requirements (3, 8, 10, 11, 14, 15, 16 & 17) described in the specifications in Appendix 1 – Requirement Specification. Based on the assessment of fulfilments, points are awarded on a scale of 0-10.) Quality: 40 (The qualitative criteria will be assessed based on the Evaluation Requirements (21, 22, 24, 26, 27, 29, 30, 32, 34, 37, 40, 42, 44, 45 & 46) described in the specifications in Appendix 1 – Requirement Specification. Based on the assessment of fulfilments, points are awarded on a scale of 0-10.) Quality: 15 (The qualitative criteria will be assessed based on the Evaluation Requirements (51, 53 & 55) described in the specifications in Appendix 1 – Requirement Specification. Based on the assessment of fulfilments, points are awarded on a scale of 0-10.)

One Photonic Wafer Probe Station (Lot 1)

The tender concerns a photonic wafer probe station to characterise the quality of photonic integrated circuits (PICs). It should be possible to characterise both optical and electrical performance. For the optical characterisation, the main coupling in/out technique will be through grating couplers but the equipment should be possible to be configured also for edge coupling. In this case, different holders and fibers may be needed. The electrical characterstics are to be characterised both in DC as well as RF up to 40GHz using probe and/or probe cards.

One Photonic Assembly Station (Lot 2)

The tender is for buying an optical assembly station for connecting fiber array units (FAUs) to an optical chip. The type of connection will be edge coupling using waveguides loops for alignment but if, necessary, the alignment can also be performed either using the light source on the chip (if it exists) or by using an external light source and connecting two FAUs, one on each side of the chip.