300 mm D2W hybrid bonding tool (IZM-131.1) - PR1254078-3460-P

1x 300 mm D2W hybrid bonding tool (IZM-131.1) The purpose of this equipment specification is to define the requirements for the automated D2W bonding for 2.5D / 3D heterogeneous QMI and chiplet integration, capable to interconnect with +/- 200nm accuracy on 300mm wafer. This equipment is capable of following process steps: 1) Automated Loading and Unloading of desired wafers from 12" Tape Frame Cassette and 12" wafers from Wafer FOUP; 2) Wafer and Tape-Frame ID-Readout; 3) Automated Feeding of Wafers onto chuck and Tape-Frame into bonding unit; 4) Pick-up of dies (components) from tape frame, optional flip, and precise bonding onto wafer or die. The programming and operating must be possible within an appropriate range of options and parameters as required for R&D. Detailed specification of each module can be found below.