The Ferdinand-Braun-Institut (FBH) plans to procure a high-performance maskless laser lithography system within the framework of the EU-funded APECS programme. The system will be used for high-resolution patterning of semiconductor wafers to support the development of advanced heterointegration technologies, including InP- and GaAs-based chiplets. It is intended to enable rapid prototyping as well as efficient processing of wafers with diameters up to 200 mm. The equipment must provide sub-micron precision combined with high throughput and support modern multi-beam laser writing technologies. It will be installed in a cleanroom environment and must comply with ISO class 5 requirements. The procurement procedure is planned for 2026.