Dostawa Die bondera (flip-chip, eutektyka)

Deadline:8 Apr 2026, 07:00

Tender information

Warszawski zachodni

Type

Contract

Procedure

Open procedure

Ref. number

F2/70/2026/ZP

Estimated value

PLN 920,921

Duration

30/04/2026 - 19/06/2026

Przedmiotem zamówienia jest dostawa, instalacja, uruchomienie i testowanie Die bondera (flip-chip, eutektyka) wraz ze szkoleniem i dokumentacją.

Buyer

Sieć Badawcza Łukasiewicz - Instytut Mikroelektroniki i Fotoniki

Documents

Document name	Upload date	File size
First document.pdf	1 Jan 1970, 00:00	1 Bytes
Second document.pdf	1 Jan 1970, 00:00	1 Bytes

Information on this page originates from the following sources: TED

Buyer

Sieć Badawcza Łukasiewicz - Instytut Mikroelektroniki i Fotoniki

Cancelled

Important dates

4 Mar - Publication date

8 Apr - Deadline

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