The Ferdinand-Braun-Institut (FBH) plans to procure a Rapid Thermal Processing (RTA) system for the processing of 200 mm wafers within the framework of the EU-funded APECS programme. The system will be used for the development and manufacturing of advanced heterogeneous integration technologies (InP-on-Si / BiCMOS). In particular, it will support key process steps such as contact formation, dopant activation, interface engineering, and post-deposition annealing processes. The equipment is intended for installation and operation in an existing cleanroom environment and must be compatible with standard semiconductor processing requirements. The procurement procedure is planned for 2026. This prior information notice is published to inform the market about the planned procurement and may be used to enable the application of shortened time limits in subsequent procurement procedures.

Prior Information Notice – Rapid Thermal Processing Equipment (RTA)

The Ferdinand-Braun-Institut (FBH) plans to procure a Rapid Thermal Processing (RTA) system for the processing of 200 mm wafers within the framework of the EU-funded APECS programme. The system will be used for the development and manufacturing of advanced heterogeneous integration technologies (InP-on-Si / BiCMOS). In particular, it will support key process steps such as contact formation, dopant activation, interface engineering, and post-deposition annealing processes. The equipment is intended for installation and operation in an existing cleanroom environment and must be compatible with standard semiconductor processing requirements. The procurement procedure is planned for 2026.