The Ferdinand-Braun-Institut (FBH) plans to procure a sputter deposition system within the framework of the EU-funded APECS programme. The system will be used for the deposition of metallic and insulating thin films on semiconductor wafers with diameters of up to 200 mm. It is intended to support advanced heterogeneous integration technologies, including InP-on-Si (BiCMOS) platforms. The equipment shall enable highly controlled thin-film processes such as metallization, interconnect formation, passivation and barrier layer deposition. A multi-chamber cluster system with integrated cleaning and deposition capabilities is required to ensure high process quality and contamination control. The system will be installed in a cleanroom environment and must be compatible with semiconductor manufacturing requirements. The procurement procedure is planned for 2026.