The Ferdinand-Braun-Institut (FBH) plans to procure a laser-based manufacturing system for advanced wafer processing within the framework of the EU-funded APECS programme. The system will be used for various opto-mechanical processing steps, including wafer dicing, laser ablation of thin layers, via drilling for backside processes, and laser-based decomposition of bonding layers. It shall be capable of processing different semiconductor materials such as SiC, GaN, Si, GaAs and InP for wafer sizes up to 200 mm. The equipment is intended to significantly expand the institute’s capabilities in high-precision wafer processing. It will be installed in a cleanroom environment and must comply with ISO class 5 requirements, including laser protection class 1. The procurement procedure is planned for 2026

Prior Information Notice – Laser Manufacturing System for Wafer Processing

The Ferdinand-Braun-Institut (FBH) plans to procure a laser-based manufacturing system for advanced wafer processing within the framework of the EU-funded APECS programme. The system will be used for various opto-mechanical processing steps, including wafer dicing, laser ablation of thin layers, via drilling for backside processes, and laser-based decomposition of bonding layers. It shall be capable of processing different semiconductor materials such as SiC, GaN, Si, GaAs and InP for wafer sizes up to 200 mm. The equipment is intended to significantly expand the institute’s capabilities in high-precision wafer processing. It will be installed in a cleanroom environment and must comply with ISO class 5 requirements, including laser protection class 1. The procurement procedure is planned for 2026.