System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1)

System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) - PR1153448-2480-P

1 Piece: System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) A fully automated process tool to be used for plasma etch processes on wafers with a diameter of 300 mm. The systems will be used for the processing of Silicon CMOS wafers in a cleanroom class 1000 (approximately class 6 EN ISO 14644-1) production environment. The new tool shall be used for patterning of high aspect ratio features in silicon as well as all related needed materials (e.g. SiO2, SiN) to reach this main target. Optional items according to Technical Tender Specification.