The Ferdinand-Braun-Institut (FBH) plans to procure an eddy current wafer mapping system within the framework of the EU-funded APECS programme. The system will be used for non-destructive electrical characterisation of semiconductor wafers during processing, including sheet resistance and conductivity measurements. It is intended to support process monitoring and quality control in advanced semiconductor manufacturing. The equipment shall enable automated, high-resolution mapping of wafers up to 200 mm in diameter and provide fast feedback on process uniformity and material properties. It will be installed in a cleanroom environment and integrated into existing process workflows. The procurement procedure is planned for 2026.