ALD System Upgrade (IPMS-CNT06.2) - PR867128-2480-P

1 ALD System Upgrade: Pulsar-Upgrade (1 Kammer an bestehendes Mainframe)/ Pulsar Upgrade (1 chamber on existing XP4-Mainframe) The following specification describes the requirements of a piece of an equipment upgrade to deposit dielectric layers (doped) HfO2 via thermal ALD processing on wafers with a diameter of 300 mm. It is required that the device continuously performs the intended functions in accordance with all the requirements specified in this EPS without malfunction or failure. In addition, the device must be supplied with all the components and parts described below that are necessary for the device to fulfill the intended functionalities and capabilities in accordance with all the requirements specified in this EPS. The second Pulsar chamber from ASM as upgrade must be compatible to the existing mainframe "XP4" and the already existing chambers "Pulsar" and "EmerALD". Optionale Leistungspositionen / Options of the product /service specification: 2.2.1.1.1 Basic configuration one additional Loadport in Front End Interface (300mm, SEMI E184) yes / no 2.2.1.1.5 Basic configuration Waferrotation/Waferindexer in process chamber for better uniformity values available yes / no 2.2.1.1.7 Basic configuration insitu ellipsometer installation ports on the chamber yes / no 2.2.1.1.9 Basic configuration The Front End Interface is equipped with a notch aligner. This has a programmable notch angle with an accuracy of ≤0.5º for the notch and ≤0.1mm for the centering yes / no 2.2.1.2.5 Cassette and wafer specification -wafer material Quartz wafers (dimensions according 2.2.1.2.6 -2.2.1.2.10) yes / no 2.2.2.8 Pulsar optional suggestion for alternative Al-Sources yes/no 2.2.2.9 Pulsar BKM process and documentation for Thermal ALD of Ta2O3 with halogenide precursor inclusive suggestions for precursors to be provided yes / no 2.2.2.13 Pulsar Option for third heated precursor source "if no Hig available alternativ delivery of heating jacket for precursor source and lines; yes/no" 2.2.3.1 Subtools Pumps are included in the offer. yes/no 2.2.3.4 Subtools necessary Ozonizer yes/no 4.3.2.16 Process Acceptance-Tests Process test: 10nm HfO2 on 3D wafers with HfCl4 and metalorganic Hf-precursors (i.e. HyALD) "Check the Step Coverage in a deep trench structure, so that min. 70-80% of the coverage thickness is reached in the bottom of a trench for aspect ratios 1:20; yes / no" 4.8.1 Warranty extension Please offer an extension of the warranty of further 12 months. During the warranty period all support, repair and parts cost are covered and free of charge. yes / no 5.1.2 Requirement items that are to be offered Set of consumables (lamps, valves, etc., chamber and process kits) yes/no 5.1.3 Requirement items that are to be offered Offline Recipe Management System yes/no 5.2.2 General options Energy consumption recording system (e.g. electricity meter) yes/no 5.2.4 General options quote and timeline for new LPV-Vessel configuration retrofit for existing Pulsar chamber as upgrade yes/no 5.2.5 General Options quote for new consumables for old pulsar chamber (lamps, valves, etc., chamber and process kits) yes/no