The Ferdinand-Braun-Institut (FBH) plans to procure wafer thinning equipment for backend processing within the framework of its ongoing infrastructure development activities. The system will be used for the thinning of semiconductor wafers up to 200 mm diameter, including materials such as GaAs, SiC, InP, GaN and silicon. Wafer thinning is a key process step prior to wafer singulation. The equipment is intended to enable precise thickness control and process monitoring, including in-situ measurement capabilities. It will be installed in a cleanroom environment and must be compatible with ISO class 5 requirements. The procurement procedure is planned for 2026.