Upgrade BEOL etching system (IPMS-CNT05.2) - PR874835-2480-P

1 piece Upgrade BEOL etching system (IPMS-CNT05.2) A process chamber to be used for plasma etch processes on wafers with a diameter of 300 mm. The process chamber shall be an upgrade on an existing cluster tool "Tokyo Elecron TACTRAS" of the Fraunhofer IPMS CNT. Optional service items: 6.12 process chamber description esc temperature adjustable by recipe step yes / no; please specify 6.24 process setup, optional Oxide etch with resist mask (as for TSV mid applications) yes / no; please specify 6.25 process setup, optional ARC etch yes / no; please specify 7.19 Process specifications / optional processes provide starting recipe for SiO2 etch with photoresist mask on 500nm Top CD, 600nm photo resist yes / no; please specify 7.20 Process specifications / optional processes provide starting recipe for ARC etch with photoresist mask on 500nm Top CD, 600nm photo resist yes / no; please specify 8.10 gas table main gases (option) SiF4 yes / no; please provide recommended flow range 8.11 gas table main gases (option) Cl2 yes / no; please provide recommended flow range 8.15 gas table side gases (option) CF4 yes / no; please provide recommended flow range 8.16 gas table side gases (option) SiCl4 yes / no; please provide recommended flow range 8.17 gas table side gases (option) Ar yes / no; please provide recommended flow range 8.18 gas table side gases (option) NF3 yes / no; please provide recommended flow range 8.19 gas table side gases (option) C4F8 yes / no; please provide recommended flow range 8.20 gas table side gases (option) CH2F2 yes / no; please provide recommended flow range 15.1 optionally quoted features Extended gas config as described in "gas table main gases (option)" and "gas table side gases (option)" yes/no 15.2 optionally quoted features Hi Temp Kit (parts list + price) yes/no 15.3 optionally quoted features recommended Spare part kit yes/no 15.4 optionally quoted features RF calibration kit for 27MHz Source generator and 13MHz Bias generator (except dummy load) yes/no 15.5 optionally quoted features vacuum pumps (rough pump) for process chamber if not generally included in system yes/no