PVD metal system for QMI connection (IPMS-MRS12.1) - PR926027-2480-P

1 piece PVD metal system for QMI connection (IPMS-MRS12.1) Equipment for sputtering of AlCu, Al, Ti/TiN and back-etching in independent chambers with planar targets over 200mm wafers. This system is necessary for two process line applications. One application is the deposition of a metal fill inside of TSV for the advanced integration of MEMS chiplets. The second application scenario is the metal system or frontside TSV filling deposition for QMI metalization systems. In both applications the conformal deposition of the barrier is necessary to achieve best contact quality. optional service items: 2.4 Handling System The tool is capable to handle two different sequences simultaneously. yes/no 2.9 Handling System Possibility for edge handling yes/no 3.6 Cassette / Wafer specifications Processing of quartz wafer according to above mentioned specs yes/no 4.5 Process System RF generators with automatic matching network to apply a substrate bias in chamber for all other sputtering chambers "100 - 600 W; yes/no" 4.16 Process System The tool is equipped with a degas station. "Chuck temperature 200°C; yes/no" 4.17 Process System The tool is equipped with a wafer buffer station. "wafer quantity in buffer ≥6; yes/no" 4.19 Process System Chuck temperature in process chamber for process "Etching" "< 20°C; yes/no" 19.6 Warranty extension Extension of the warranty of further 12 months. yes/no 21.9 Uptime / Repair / Reliability Set of consumable parts (lamps, o-rings, valves, etc.) to cover the basic warranty period yes/no