Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P

1 Piece -Die-to-Wafer Bonder (IPMS-MRS14.1) Option 1 (LV Pos. 1.13): Please offer an extended warranty of further 12 months (in total 24 month) Option 2 (LV Pos. 3.6): The tool should handle wafers with the size of (source and target) Option 3 (LV Pos. 3.14): The chiplets can be picked from this type of tray (source) Option 4 (LV Pos. 4.1): The system can be controlled using SECS-GEM commands. The following protocols must be supported: E30, E5, E37 and E10. Alternatively, a proprietary but completely documented communication interface has to be provided.